{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679861","patent":{"patent_number":"US-9679861","title":"Integrated circuit package with active warpage control printed circuit board mount","assignee":null,"inventors":[],"filing_date":"2016-03-24T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit package may include a package substrate having a surface, first interconnects of a first size that are arranged in a substantially circular shape that is centered on the surface of the package substrate, and second interconnects of a second size that is different from the first size, where the second interconnects are arranged in a ring shape on the surface of the package substrate. The ring shape of the second interconnects is concentric with the substantially circular shape of the first interconnects. The integrated circuit package may further include third interconnects of a third size that are arranged in peripheral corner regions on the surface of the package substrate. The third size may be smaller or bigger than at least one of the first and second sizes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package with active warpage control printed circuit board mount","description":"An integrated circuit package may include a package substrate having a surface, first interconnects of a first size that are arranged in a substantially circular shape that is centered on the surface ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679861","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679861","citation_suggestion":"Patentable. \"Integrated circuit package with active warpage control printed circuit board mount\" (US-9679861). https://patentable.app/patents/US-9679861","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679861","json":"https://patentable.app/api/llm-context/US-9679861","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:47:26.860Z"}