{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679865","patent":{"patent_number":"US-9679865","title":"Substrate for semiconductor package and semiconductor package having the same","assignee":null,"inventors":[],"filing_date":"2014-04-15T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A semiconductor package includes a substrate including a core layer having a first surface and a second surface which is opposite to the first surface, a wiring layer formed over the first and second surfaces and in an inside of the core layer, and having a first electrode disposed in the inside of the core layer and exposed from the core layer and a second electrode disposed over the first surface, and a passivation layer formed over the first and second surface of the core layer such that the first and the second electrodes are exposed; a first semiconductor chip disposed over the first surface of the core layer; a second semiconductor chip stacked over the first semiconductor chip; a first connection member for connecting the first semiconductor chip with the first electrode; and a second connection member for connecting the second semiconductor chip with the second electrode."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate for semiconductor package and semiconductor package having the same","description":"A semiconductor package includes a substrate including a core layer having a first surface and a second surface which is opposite to the first surface, a wiring layer formed over the first and second ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679865","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679865","citation_suggestion":"Patentable. \"Substrate for semiconductor package and semiconductor package having the same\" (US-9679865). https://patentable.app/patents/US-9679865","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679865","json":"https://patentable.app/api/llm-context/US-9679865","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:37:45.792Z"}