{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9679872","patent":{"patent_number":"US-9679872","title":"Connection structure for semiconductor package having plural vias located within projection of conductive unit","assignee":null,"inventors":[],"filing_date":"2016-08-31T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A connection structure is provided. The connection structure comprises a conductive unit, a solder bump, a first insulating layer, a second insulating layer, a third insulating layer, and a plurality of vias. The solder bump is in direct contact with the conductive unit. The first insulating layer is located under a flange of the conductive unit. The second insulating layer is located under a base of the conductive unit. The third insulating layer is located under the second insulating layer. The third insulating layer has a via zone. A plurality of vias are located in the via zone. The via zone is within a vertical projection of the conductive unit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Connection structure for semiconductor package having plural vias located within projection of conductive unit","description":"A connection structure is provided. The connection structure comprises a conductive unit, a solder bump, a first insulating layer, a second insulating layer, a third insulating layer, and a plurality ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9679872","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9679872","citation_suggestion":"Patentable. \"Connection structure for semiconductor package having plural vias located within projection of conductive unit\" (US-9679872). https://patentable.app/patents/US-9679872","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9679872","json":"https://patentable.app/api/llm-context/US-9679872","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:45:54.052Z"}