{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9681032","patent":{"patent_number":"US-9681032","title":"Imager module with molded packaging","assignee":null,"inventors":[],"filing_date":"2015-03-17T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H04N","H04N","H04N","H01L"],"num_claims":20,"abstract":"An imager assembly having a molded package formed using a molded interconnect device (MID) technique having a rim portion protruding from a surface of the molded package is disclosed. A lens may be held by the rim portion protruding from the surface and an image sensor may be disposed on the surface. The molded package may further be mechanically and electrically coupled to an electromechanical device, such as a voice coil motor (VCM). The VCM may be configured to move the lens held by the molded package for the purposes of focusing an image on the image sensor. Additionally, an imager assembly with a sandwich molded package having a first high density interconnect (HDI) layer and a second HDI layer with surface mount devices (SMDs) and molding compound therebetween is disclosed. The imager assembly may further include an image sensor, lens assembly, and VCM disposed on the sandwich molded package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Imager module with molded packaging","description":"An imager assembly having a molded package formed using a molded interconnect device (MID) technique having a rim portion protruding from a surface of the molded package is disclosed. A lens may be he","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9681032","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9681032","citation_suggestion":"Patentable. \"Imager module with molded packaging\" (US-9681032). https://patentable.app/patents/US-9681032","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9681032","json":"https://patentable.app/api/llm-context/US-9681032","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:59:34.282Z"}