{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9681536","patent":{"patent_number":"US-9681536","title":"Package substrate and method for fabricating the same","assignee":null,"inventors":[],"filing_date":"2016-08-28T00:00:00.000Z","publication_date":"2017-06-13T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"Method of fabricating package substrates includes providing a substrate including a capacitance layer sandwiched between first patterned circuits and second patterned circuit, in which a gap is formed between adjacent two of the first patterned circuits, and exposed a first region of the capacitance layer, and the second patterned circuit is overlapped with the first region; removing a part of the capacitance layer within the first region, to form an opening communicated with the gap; forming a dielectric layer from a side of the capacitance layer disposed with the first patterned circuits to fill up the gap and the opening; and removing a part of the dielectric layer within the gap and the opening to form a through hole to expose a part of the second patterned circuit, the remaining part of the first dielectric layer covers the capacitance layer and the first patterned circuits."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate and method for fabricating the same","description":"Method of fabricating package substrates includes providing a substrate including a capacitance layer sandwiched between first patterned circuits and second patterned circuit, in which a gap is formed","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9681536","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9681536","citation_suggestion":"Patentable. \"Package substrate and method for fabricating the same\" (US-9681536). https://patentable.app/patents/US-9681536","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9681536","json":"https://patentable.app/api/llm-context/US-9681536","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:07:58.605Z"}