{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9682541","patent":{"patent_number":"US-9682541","title":"Bonding method","assignee":null,"inventors":[],"filing_date":"2014-12-10T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bonding method","description":"A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and su","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9682541","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9682541","citation_suggestion":"Patentable. \"Bonding method\" (US-9682541). https://patentable.app/patents/US-9682541","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9682541","json":"https://patentable.app/api/llm-context/US-9682541","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:47:36.375Z"}