{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685351","patent":{"patent_number":"US-9685351","title":"Wire bond mold lock method and structure","assignee":null,"inventors":[],"filing_date":"2014-07-18T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A method and apparatus are described for fabricating a microchip structure (70) which protects interior electrical integrated circuits and components (120) attached to a lead frame die flag (104) using a molding compound (124) that mechanically interlocks with one or more positive mold lock structures formed as dummy wire loops (114) or stud bumps (214) that are attached to the lead frame (100) and/or die flag (104)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wire bond mold lock method and structure","description":"A method and apparatus are described for fabricating a microchip structure (70) which protects interior electrical integrated circuits and components (120) attached to a lead frame die flag (104) usin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685351","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685351","citation_suggestion":"Patentable. \"Wire bond mold lock method and structure\" (US-9685351). https://patentable.app/patents/US-9685351","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685351","json":"https://patentable.app/api/llm-context/US-9685351","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:40:06.144Z"}