{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685366","patent":{"patent_number":"US-9685366","title":"Forming chamferless vias using thermally decomposable porefiller","assignee":null,"inventors":[],"filing_date":"2016-04-21T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A method for forming chamferless vias comprises receiving a substrate stack comprising a hard mask layer, a porous dielectric layer underlying the hard mask layer, a cap layer underlying the dielectric layer, and a conductive layer underlying the cap layer. The hard mask layer is opened to reveal a portion of the dielectric layer. A plurality of vias are opened to extend through the dielectric layer and the cap layer. A pore filling material comprising a thermally decomposable polymer is deposited into the vias. The pore filling material in the vias is hardened and driven into the pores of the dielectric layer adjacent to the vias by an annealing process. The hard mask layer is removed. A trench is patterned and etched coincident with the vias. A dissipation process is conducted to remove the pore filling material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Forming chamferless vias using thermally decomposable porefiller","description":"A method for forming chamferless vias comprises receiving a substrate stack comprising a hard mask layer, a porous dielectric layer underlying the hard mask layer, a cap layer underlying the dielectri","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685366","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685366","citation_suggestion":"Patentable. \"Forming chamferless vias using thermally decomposable porefiller\" (US-9685366). https://patentable.app/patents/US-9685366","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685366","json":"https://patentable.app/api/llm-context/US-9685366","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:15:05.245Z"}