{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685370","patent":{"patent_number":"US-9685370","title":"Titanium tungsten liner used with copper interconnects","assignee":null,"inventors":[],"filing_date":"2014-12-18T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Approaches for providing a liner at a via-to-wire interface are provided. A method includes: forming a via opening that exposes an upper surface of a copper wire; forming a titanium liner on the upper surface of the wire; forming a tungsten liner on the titanium liner; and forming a via on the second liner in the via opening."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Titanium tungsten liner used with copper interconnects","description":"Approaches for providing a liner at a via-to-wire interface are provided. A method includes: forming a via opening that exposes an upper surface of a copper wire; forming a titanium liner on the upper","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685370","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685370","citation_suggestion":"Patentable. \"Titanium tungsten liner used with copper interconnects\" (US-9685370). https://patentable.app/patents/US-9685370","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685370","json":"https://patentable.app/api/llm-context/US-9685370","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:52:46.748Z"}