{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685377","patent":{"patent_number":"US-9685377","title":"Wafer processing method","assignee":null,"inventors":[],"filing_date":"2015-12-03T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A wafer is divided into individual device chips along a plurality of scheduled division lines. A protective film is formed by coating liquid-state resin, which is hardened by irradiation of ultraviolet rays thereon, on the front face of the wafer. The protective film is hardened by irradiating ultraviolet rays upon the protective film. A protective tape is adhered on a front face of the hardened protective film. A modified layer is formed by irradiating a laser beam of a wavelength having a transparency to the wafer along the scheduled division lines with a focal point thereof positioned in the inside of the wafer. A back face of the wafer is ground while grinding water is supplied to thin the wafer to a given thickness and divide the wafer into the individual device chips along the scheduled division lines using the modified layer as a start point of the break."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing method","description":"A wafer is divided into individual device chips along a plurality of scheduled division lines. A protective film is formed by coating liquid-state resin, which is hardened by irradiation of ultraviole","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685377","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685377","citation_suggestion":"Patentable. \"Wafer processing method\" (US-9685377). https://patentable.app/patents/US-9685377","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685377","json":"https://patentable.app/api/llm-context/US-9685377","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:52:42.873Z"}