{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685390","patent":{"patent_number":"US-9685390","title":"Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer","assignee":null,"inventors":[],"filing_date":"2012-06-08T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A microelectronic package having an encapsulated substrate comprising a plurality of microelectronic devices encapsulated within an encapsulation material, wherein the encapsulated structure may have an active surface proximate the active surfaces of the plurality of microelectronic devices, and wherein at least one of the plurality of microelectronic devices may have a height greater than another of the plurality of microelectronic devices (e.g. non-coplanar). The microelectronic package further includes a bumpless build-up layer structure formed proximate the encapsulated structure active surface. The microelectronic package may also have an active surface microelectronic device positioned proximate the encapsulated structure active surface and in electrical contact with at least one of the plurality of microelectronic devices of the encapsulated substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer","description":"A microelectronic package having an encapsulated substrate comprising a plurality of microelectronic devices encapsulated within an encapsulation material, wherein the encapsulated structure may have ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685390","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685390","citation_suggestion":"Patentable. \"Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer\" (US-9685390). https://patentable.app/patents/US-9685390","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685390","json":"https://patentable.app/api/llm-context/US-9685390","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:17:01.667Z"}