{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685391","patent":{"patent_number":"US-9685391","title":"Wiring board and semiconductor package","assignee":null,"inventors":[],"filing_date":"2016-04-05T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A wiring board includes a substrate having first and second opposite surfaces, a first adhesive layer on the first surface of the substrate, a thermal diffusion metal pattern on the first adhesive layer, multiple vias vertically extending from the thermal diffusion metal pattern into the substrate through the first adhesive layer with a gap around each of the vias in the substrate and the first adhesive layer, and a second adhesive layer on the second surface of the substrate. The thermal diffusion metal pattern is not to be electrically connected to a semiconductor device to be mounted. The second adhesive layer fills in the gap around each of the vias within the substrate and the first adhesive layer. The gap includes a first gap and a second gap in the substrate and the first adhesive layer, respectively. The second gap is greater in lateral size than the first gap."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring board and semiconductor package","description":"A wiring board includes a substrate having first and second opposite surfaces, a first adhesive layer on the first surface of the substrate, a thermal diffusion metal pattern on the first adhesive lay","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685391","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685391","citation_suggestion":"Patentable. \"Wiring board and semiconductor package\" (US-9685391). https://patentable.app/patents/US-9685391","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685391","json":"https://patentable.app/api/llm-context/US-9685391","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:37:26.426Z"}