{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685397","patent":{"patent_number":"US-9685397","title":"Semiconductor package with clip structure","assignee":null,"inventors":[],"filing_date":"2015-09-09T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A semiconductor package comprise a downset has a first end coupled to a connection portion and a second opposite end electrically coupled to a lead of a lead frame; and an adhesion layer disposed between the lead and the second end of the downset to allow adhesion therebeween; wherein the downset is bent in a non-right angle at the first end thereof such that a bottom face of the second end of the downset is tilted toward a top face of the lead and thus a first side of both sides of the bottom face is closer to the top face of the lead than a second side opposite the first side, wherein a first trap region is defined between a side face of the second end at the first side and the top face of the lead to trap therein an adhesion material of the adhesion layer, wherein a second trap region is defined between the bottom face of the second end and the top face of the lead to trap therein an adhesion material of the adhesion layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with clip structure","description":"A semiconductor package comprise a downset has a first end coupled to a connection portion and a second opposite end electrically coupled to a lead of a lead frame; and an adhesion layer disposed betw","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685397","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685397","citation_suggestion":"Patentable. \"Semiconductor package with clip structure\" (US-9685397). https://patentable.app/patents/US-9685397","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685397","json":"https://patentable.app/api/llm-context/US-9685397","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:45:09.791Z"}