{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685398","patent":{"patent_number":"US-9685398","title":"Thin semiconductor device packages","assignee":null,"inventors":[],"filing_date":"2016-03-28T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"In a general aspect, a packaged semiconductor device can include a semiconductor die having at least a first terminal on a first side of the semiconductor die and a second terminal on a second side of the semiconductor die. The device can include a leadframe portion electrically coupled to the first terminal of the semiconductor die and a clip portion electrically coupled to the second terminal of the semiconductor die. The device can include a molding compound. A surface of the leadframe portion and a first surface of the molding compound can define at least a portion of a first surface of the device. A surface of the clip portion and a second surface of the molding compound can define at least a portion of a second surface of the device that is parallel to the first surface of the device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thin semiconductor device packages","description":"In a general aspect, a packaged semiconductor device can include a semiconductor die having at least a first terminal on a first side of the semiconductor die and a second terminal on a second side of","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685398","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685398","citation_suggestion":"Patentable. \"Thin semiconductor device packages\" (US-9685398). https://patentable.app/patents/US-9685398","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685398","json":"https://patentable.app/api/llm-context/US-9685398","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:38:12.933Z"}