{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685405","patent":{"patent_number":"US-9685405","title":"Fuse/resistor utilizing interconnect and vias and method of making","assignee":null,"inventors":[],"filing_date":"2013-05-31T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":4,"abstract":"A semiconductor structure comprising a fuse/resistor structure over a functional layer having a substrate. The fuse/resistor structure includes a via, a first interconnect layer, and a second interconnect layer. The via is over the functional layer and has a first end and a second end vertically opposite the first end, wherein the first end is bounded by a first edge and a second edge opposite the first edge and the second end is bounded by a third edge and a fourth edge opposite the third edge. The first interconnect layer includes a first metal layer running horizontally and contacting the first end and completely extending from the first edge to the second edge. The second interconnect layer includes a second metal layer running horizontally and contacting the second end of the via and extending past the third edge but reaching less than half way to the fourth edge."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fuse/resistor utilizing interconnect and vias and method of making","description":"A semiconductor structure comprising a fuse/resistor structure over a functional layer having a substrate. The fuse/resistor structure includes a via, a first interconnect layer, and a second intercon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685405","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685405","citation_suggestion":"Patentable. \"Fuse/resistor utilizing interconnect and vias and method of making\" (US-9685405). https://patentable.app/patents/US-9685405","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685405","json":"https://patentable.app/api/llm-context/US-9685405","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:55:43.858Z"}