{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685427","patent":{"patent_number":"US-9685427","title":"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture","assignee":null,"inventors":[],"filing_date":"2017-03-24T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","G11C","G11C","G11C","G11C","G11C","G11C","G11C","G11C","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package can include a first semiconductor device and a second semiconductor device stacked in a first direction. The first semiconductor device can include a first through via providing a first electrical connection in the first direction between a first side and a second side opposite the first side of the first semiconductor device, and a first circuit that provides a first potential greater than a ground potential at a first circuit output. The first circuit output can be directly connected with wiring layers to the first via at the first side. The second semiconductor device can be electrically connected to the first through via at the second side of the first semiconductor device to receive the first potential."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture","description":"A package can include a first semiconductor device and a second semiconductor device stacked in a first direction. The first semiconductor device can include a first through via providing a first elec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685427","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685427","citation_suggestion":"Patentable. \"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture\" (US-9685427). https://patentable.app/patents/US-9685427","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685427","json":"https://patentable.app/api/llm-context/US-9685427","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:44:45.372Z"}