{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685455","patent":{"patent_number":"US-9685455","title":"Method of manufacturing semiconductor device having 3D structure","assignee":null,"inventors":[],"filing_date":"2016-12-20T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"The technique described herein can form a semiconductor device having a favorable characteristic over a flash memory with a 3D structure. Provided is a method of manufacturing a semiconductor device, including: (a) forming a stacked structure having an insulating film and a sacrificial film stacked therein by performing a combination a plurality of times, the combination including: (a-1) forming the insulating film on a substrate; (a-2) forming the sacrificial film on the insulating film; and (a-3) modifying at least one of the insulating film and the sacrificial film to reduce a difference between stresses of the insulating film and the sacrificial film."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing semiconductor device having 3D structure","description":"The technique described herein can form a semiconductor device having a favorable characteristic over a flash memory with a 3D structure. Provided is a method of manufacturing a semiconductor device, ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685455","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685455","citation_suggestion":"Patentable. \"Method of manufacturing semiconductor device having 3D structure\" (US-9685455). https://patentable.app/patents/US-9685455","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685455","json":"https://patentable.app/api/llm-context/US-9685455","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:56:45.001Z"}