{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9685478","patent":{"patent_number":"US-9685478","title":"Flip-chip bonding method and solid-state image pickup device manufacturing method characterized in including flip-chip bonding method","assignee":null,"inventors":[],"filing_date":"2013-10-02T00:00:00.000Z","publication_date":"2017-06-20T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"An electrode of an electronic component element (1) is bonded to an electrode (5) of a substrate (4) via a bump (2) by: after applying, to the bump (2), only a first pressure which is not less than a yield stress of a bulk material of which the bump (2) is made, reducing or stopping the application of the first pressure; and while applying a given ultrasonic vibration to the bump (2), gradually applying a pressure to the bump (2) until the pressure reaches a second pressure which is not less than the yield stress of the bulk material of which the bump (2) is made."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Flip-chip bonding method and solid-state image pickup device manufacturing method characterized in including flip-chip bonding method","description":"An electrode of an electronic component element (1) is bonded to an electrode (5) of a substrate (4) via a bump (2) by: after applying, to the bump (2), only a first pressure which is not less than a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9685478","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9685478","citation_suggestion":"Patentable. \"Flip-chip bonding method and solid-state image pickup device manufacturing method characterized in including flip-chip bonding method\" (US-9685478). https://patentable.app/patents/US-9685478","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9685478","json":"https://patentable.app/api/llm-context/US-9685478","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:52:21.322Z"}