{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9691661","patent":{"patent_number":"US-9691661","title":"Low profile IC package","assignee":null,"inventors":[],"filing_date":"2016-03-18T00:00:00.000Z","publication_date":"2017-06-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An IC package without using an interposer is disclosed to form a low profile IC package. A single redistribution layer is fabricated according to IC process. A plurality of bottom pads is formed on a bottom of the single redistribution layer adaptive for the IC package to mount onto a mother board. A plurality of top pads is formed on a top of the single redistribution layer. An IC chip mounts on the plurality of top pads. A first molding compound wraps the single redistribution layer on four sides; and a second molding compound embeds the IC chip on top of the redistribution layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Low profile IC package","description":"An IC package without using an interposer is disclosed to form a low profile IC package. A single redistribution layer is fabricated according to IC process. A plurality of bottom pads is formed on a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9691661","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9691661","citation_suggestion":"Patentable. \"Low profile IC package\" (US-9691661). https://patentable.app/patents/US-9691661","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9691661","json":"https://patentable.app/api/llm-context/US-9691661","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:54:01.086Z"}