{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9691697","patent":{"patent_number":"US-9691697","title":"Semiconductor device and method of manufacturing semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-09-28T00:00:00.000Z","publication_date":"2017-06-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A terminal pressing frame of a semiconductor device is disposed so as to form a first gap partially from the bottom surface of an L-shaped leg portion of an external terminal and a second gap from an inside surface of a resin case. Adhesive spreads to the second gap and further spreads to the first gap connected to the second gap, consequent to the pressure when a metal base is assembled. The spreading of the adhesive to the first gap fixes an L-shaped leg portion of the external terminal and the terminal pressing frame to each other; and the spreading of adhesive to the second gap fixes the resin case and the terminal pressing frame to each other."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method of manufacturing semiconductor device","description":"A terminal pressing frame of a semiconductor device is disposed so as to form a first gap partially from the bottom surface of an L-shaped leg portion of an external terminal and a second gap from an ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9691697","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9691697","citation_suggestion":"Patentable. \"Semiconductor device and method of manufacturing semiconductor device\" (US-9691697). https://patentable.app/patents/US-9691697","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9691697","json":"https://patentable.app/api/llm-context/US-9691697","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:51:40.009Z"}