{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9691717","patent":{"patent_number":"US-9691717","title":"Fabricating process for package substrate","assignee":null,"inventors":[],"filing_date":"2016-09-14T00:00:00.000Z","publication_date":"2017-06-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A core substrate is prepared first, a bottom redistribution layer RDL1 is formed. Any warpage of the RDL1 is suppressed by the core substrate. In a later process, warpage is further suppressed by a molding compound encapsulating the core substrate. A plurality of metal pillars are formed passing through the core substrate longitudinally; a top redistribution layer RDL2 is then formed on a top surface of the metal pillars."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fabricating process for package substrate","description":"A core substrate is prepared first, a bottom redistribution layer RDL1 is formed. Any warpage of the RDL1 is suppressed by the core substrate. In a later process, warpage is further suppressed by a mo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9691717","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9691717","citation_suggestion":"Patentable. \"Fabricating process for package substrate\" (US-9691717). https://patentable.app/patents/US-9691717","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9691717","json":"https://patentable.app/api/llm-context/US-9691717","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:18:30.767Z"}