{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9691726","patent":{"patent_number":"US-9691726","title":"Methods for forming fan-out package structure","assignee":null,"inventors":[],"filing_date":"2014-07-08T00:00:00.000Z","publication_date":"2017-06-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A method includes forming a first composite wafer including molding a plurality of device dies and a plurality of through-vias in a first molding material, and forming redistribution lines on opposite sides of the first molding material. The redistribution lines are inter-coupled through the plurality of through-vias. The method further includes forming a second composite wafer including stacking a plurality of dies to form a plurality of die stacks, and molding the plurality of die stacks in a second molding material. The second molding material fills gaps between the plurality of die stacks. The first composite wafer is bonded to the second composite wafer to form a third composite wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods for forming fan-out package structure","description":"A method includes forming a first composite wafer including molding a plurality of device dies and a plurality of through-vias in a first molding material, and forming redistribution lines on opposite","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9691726","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9691726","citation_suggestion":"Patentable. \"Methods for forming fan-out package structure\" (US-9691726). https://patentable.app/patents/US-9691726","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9691726","json":"https://patentable.app/api/llm-context/US-9691726","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:03:38.912Z"}