{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9691727","patent":{"patent_number":"US-9691727","title":"Pad-less interconnect for electrical coreless substrate","assignee":null,"inventors":[],"filing_date":"2015-04-14T00:00:00.000Z","publication_date":"2017-06-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrically conductive first plug is in contact with the surface finish layer and an electrically conductive subsequent plug is disposed on the mounting substrate land side and it is electrically coupled to the electrically conductive first plug and disposed directly below the electrically conductive first plug."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Pad-less interconnect for electrical coreless substrate","description":"A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrical","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9691727","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9691727","citation_suggestion":"Patentable. \"Pad-less interconnect for electrical coreless substrate\" (US-9691727). https://patentable.app/patents/US-9691727","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9691727","json":"https://patentable.app/api/llm-context/US-9691727","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:44:50.009Z"}