{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9691745","patent":{"patent_number":"US-9691745","title":"Bonding structure for forming a package on package (PoP) structure and method for forming the same","assignee":null,"inventors":[],"filing_date":"2013-06-26T00:00:00.000Z","publication_date":"2017-06-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the substrate. The semiconductor device package further includes a conductive element formed on the metal pad, and the metal pad electrically contacts the conductive element, and at least a portion of the conductive element is embedded in a molding compound, and the conductive element has a recess configured to provide an additional bonding interfacial area."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bonding structure for forming a package on package (PoP) structure and method for forming the same","description":"Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the sub","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9691745","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9691745","citation_suggestion":"Patentable. \"Bonding structure for forming a package on package (PoP) structure and method for forming the same\" (US-9691745). https://patentable.app/patents/US-9691745","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9691745","json":"https://patentable.app/api/llm-context/US-9691745","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:53:52.661Z"}