{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9693469","patent":{"patent_number":"US-9693469","title":"Electronic module subassemblies","assignee":null,"inventors":[],"filing_date":"2013-12-19T00:00:00.000Z","publication_date":"2017-06-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate. The middle laminate has a plurality of web areas, each web area defining at least one hole. The defines a planar top surface and a plurality of open areas corresponding to and aligned with the plurality of web areas. First components have a first thickness. At least one first component is in each of the open areas. Second components have a second thickness relatively larger than the first thickness. At least one second component is in each of the open areas. The second components extend into the respective at least one hole of the web areas. Encapsulant fills in the open areas and the web areas."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic module subassemblies","description":"An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate. T","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9693469","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9693469","citation_suggestion":"Patentable. \"Electronic module subassemblies\" (US-9693469). https://patentable.app/patents/US-9693469","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9693469","json":"https://patentable.app/api/llm-context/US-9693469","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:52:53.116Z"}