{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9698027","patent":{"patent_number":"US-9698027","title":"Method of fabricating integrated circuits having a recessed molding package and corresponding package","assignee":null,"inventors":[],"filing_date":"2016-03-22T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"A method may include providing an electrically conductive laminar base member having a die attachment portion and a lead frame portion, producing a distribution of holes opening at a front surface of the base member, attaching an integrated circuit onto the front surface of the base member at the attachment portion, and producing a wire bonding pattern between the integrated circuit and wire bonding locations on the front surface of the base member at the lead frame portion. An electrically insulating package molding compound may be molded onto the front surface of the base member so that the integrated circuit and the wire bonding pattern are embedded in the package molding compound which penetrates into the holes opening at the front surface of the base member. The base member may be selectively etched from its back surface to produce residual portions of the base member at the wire bonding locations."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of fabricating integrated circuits having a recessed molding package and corresponding package","description":"A method may include providing an electrically conductive laminar base member having a die attachment portion and a lead frame portion, producing a distribution of holes opening at a front surface of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9698027","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9698027","citation_suggestion":"Patentable. \"Method of fabricating integrated circuits having a recessed molding package and corresponding package\" (US-9698027). https://patentable.app/patents/US-9698027","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9698027","json":"https://patentable.app/api/llm-context/US-9698027","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:39:06.437Z"}