{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9698042","patent":{"patent_number":"US-9698042","title":"Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge","assignee":null,"inventors":[],"filing_date":"2016-07-22T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A method for reducing slippage of a wafer during film deposition includes pumping out a processing chamber while the wafer is supported on lift pins or a carrier ring and lowering the wafer onto support members configured to minimize wafer slippage during deposition of the film. A multi-station processing chamber, such as a processing chamber for atomic layer deposition, can include a chuck-less pedestal at each station having wafer supports configured to prevent the wafer from moving off center by more than 400 microns. To minimize a gas cushion beneath the wafer, the wafer supports can provide a gap of at least 2 mils between the back side of the wafer and the wafer-facing surface of the pedestal."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge","description":"A method for reducing slippage of a wafer during film deposition includes pumping out a processing chamber while the wafer is supported on lift pins or a carrier ring and lowering the wafer onto suppo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9698042","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9698042","citation_suggestion":"Patentable. \"Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge\" (US-9698042). https://patentable.app/patents/US-9698042","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9698042","json":"https://patentable.app/api/llm-context/US-9698042","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:56:27.634Z"}