{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9698077","patent":{"patent_number":"US-9698077","title":"Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device","assignee":null,"inventors":[],"filing_date":"2013-12-20T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m° C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds. The heat conductive silicone composition provides a cured object having a storage modulus, loss modulus, and coefficient of loss within appropriate ranges; peeling and pump out during heating/cooling cycle tending not to occur, and increases in thermal resistance being suppressed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device","description":"Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9698077","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9698077","citation_suggestion":"Patentable. \"Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device\" (US-9698077). https://patentable.app/patents/US-9698077","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9698077","json":"https://patentable.app/api/llm-context/US-9698077","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:05:53.752Z"}