{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9698082","patent":{"patent_number":"US-9698082","title":"Au-based solder die attachment semiconductor device and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2013-11-13T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor device according to the present invention, having an Au-based solder layer (3) sandwiched between a semiconductor element (1) and a Cu substrate (2) made mainly of Cu, in which the semiconductor device includes: a dense metal film (23) which is arranged between the Cu substrate (2) and the Au-based solder layer (3), and has fine slits (24) patterned to have a predetermined shape in a plan view; and fine structures (4) with dumbbell-like cross section, which have Cu and Au as main elements, and are each buried in the Cu substrate (2), the Au-based solder layer (3), and the fine slits (24) of the dense metal film (23)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Au-based solder die attachment semiconductor device and method for manufacturing the same","description":"A semiconductor device according to the present invention, having an Au-based solder layer (3) sandwiched between a semiconductor element (1) and a Cu substrate (2) made mainly of Cu, in which the sem","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9698082","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9698082","citation_suggestion":"Patentable. \"Au-based solder die attachment semiconductor device and method for manufacturing the same\" (US-9698082). https://patentable.app/patents/US-9698082","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9698082","json":"https://patentable.app/api/llm-context/US-9698082","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:40:45.973Z"}