{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9698100","patent":{"patent_number":"US-9698100","title":"Structure and method for interconnection","assignee":null,"inventors":[],"filing_date":"2015-08-19T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure provides a method of fabricating an integrated circuit in accordance with some embodiments. The method includes providing a substrate having a first conductive feature in a first dielectric material layer; selectively etching the first conductive feature, thereby forming a recessed trench on the first conductive feature; forming an etch stop layer on the first dielectric material layer, on the first conductive feature and sidewalls of the recessed trench; forming a second dielectric material layer on the etch stop layer; forming an opening in the second dielectric material layer; and forming a second conductive feature in the opening of the second dielectric material layer. The second conductive feature is electrically connected with the first conductive feature."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Structure and method for interconnection","description":"The present disclosure provides a method of fabricating an integrated circuit in accordance with some embodiments. The method includes providing a substrate having a first conductive feature in a firs","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9698100","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9698100","citation_suggestion":"Patentable. \"Structure and method for interconnection\" (US-9698100). https://patentable.app/patents/US-9698100","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9698100","json":"https://patentable.app/api/llm-context/US-9698100","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T18:31:09.176Z"}