{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9698121","patent":{"patent_number":"US-9698121","title":"Methods and structures for packaging semiconductor dies","assignee":null,"inventors":[],"filing_date":"2014-01-27T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of packaging a semiconductor device, comprising: attaching a plurality of dies to a carrier wafer, wherein each of the dies includes a top surface; forming a molding compound layer over the dies, wherein the top surface of the dies are covered by the molding compound layer; removing a first portion of the molding compound layer; removing a second portion of the molding compound layer such that the top surface of the dies is not covered by the molding compound layer; forming a redistribution layer (RDL) over the top surface of the dies; forming a plurality of solder balls over at least a portion of the RDL; and singulating the dies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods and structures for packaging semiconductor dies","description":"A method of packaging a semiconductor device, comprising: attaching a plurality of dies to a carrier wafer, wherein each of the dies includes a top surface; forming a molding compound layer over the d","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9698121","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9698121","citation_suggestion":"Patentable. \"Methods and structures for packaging semiconductor dies\" (US-9698121). https://patentable.app/patents/US-9698121","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9698121","json":"https://patentable.app/api/llm-context/US-9698121","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:53:52.015Z"}