{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9698122","patent":{"patent_number":"US-9698122","title":"Semiconductor package structure and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-07-27T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure has a substrate and a die stack of n die(s), wherein n≧1. The substrate has a first side, a second side and an opening extending from the first side to the second side. The die stack is disposed in the opening. The thickness of the substrate is substantially the same as the thickness of the die stack."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package structure and method for manufacturing the same","description":"A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure has a substrate and a die stack of n die(s), wherein n≧1. The substrate has ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9698122","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9698122","citation_suggestion":"Patentable. \"Semiconductor package structure and method for manufacturing the same\" (US-9698122). https://patentable.app/patents/US-9698122","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9698122","json":"https://patentable.app/api/llm-context/US-9698122","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:05:59.866Z"}