{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9698124","patent":{"patent_number":"US-9698124","title":"Embedded circuit package","assignee":null,"inventors":[],"filing_date":"2016-02-29T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"An embedded integrated circuit package is made by providing a substrate with a patterned conductor layer defining bond pads. One or more components typically with upwardly facing contact pads are mounted on the substrate. The contact pads are wire bonded to the bond pads of the patterned conductor layer. A series of layers, each with one or more cut-outs corresponding to locations of the components forms a first solid stack containing cavities accommodating the components and associated wires. In one embodiment the layers are fiberglass layers and the layers are cured in the presence of a resin to form a solid body. In another embodiment the layers are thermoplastic layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Embedded circuit package","description":"An embedded integrated circuit package is made by providing a substrate with a patterned conductor layer defining bond pads. One or more components typically with upwardly facing contact pads are moun","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9698124","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9698124","citation_suggestion":"Patentable. \"Embedded circuit package\" (US-9698124). https://patentable.app/patents/US-9698124","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9698124","json":"https://patentable.app/api/llm-context/US-9698124","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T17:46:16.223Z"}