{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9699891","patent":{"patent_number":"US-9699891","title":"Substrate and method for mounting semiconductor package","assignee":null,"inventors":[],"filing_date":"2012-03-23T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":7,"abstract":"A substrate includes a join-structure including a semiconductor package, first electrode pad, bump, second electrode pad, and circuit substrate joined in the order named. The substrate also includes a first wire and a second wire formed in a region below a corner of the semiconductor package. The first and second wires are configured to detect a change in electrical resistance value when the first wire or the second wire is disconnected. One of the first and second wires is connected to the first electrode pad or the second electrode pad. A break strength of each of the first wire and the second wire is lower than a break strength of the join-structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate and method for mounting semiconductor package","description":"A substrate includes a join-structure including a semiconductor package, first electrode pad, bump, second electrode pad, and circuit substrate joined in the order named. The substrate also includes a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9699891","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9699891","citation_suggestion":"Patentable. \"Substrate and method for mounting semiconductor package\" (US-9699891). https://patentable.app/patents/US-9699891","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9699891","json":"https://patentable.app/api/llm-context/US-9699891","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:41:19.724Z"}