{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9699897","patent":{"patent_number":"US-9699897","title":"Pad structure","assignee":null,"inventors":[],"filing_date":"2012-09-28T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"One or more techniques or systems for mitigating peeling associated with a pad, such as a pad of a semiconductor, are provided herein. In some embodiments, a pad structure for mitigating peeling comprises a bond region located above a first region. In some embodiments, a first inter-layer dielectric region associated with the first region is formed in an inter-layer region under the pad. Additionally, a first inter-metal dielectric region associated with the first region is formed in an inter-metal region under the inter-layer region. In some embodiments, the first inter-metal region is formed under the first inter-layer region. In this manner, peeling associated with the pad structure is mitigated, at least because the first inter-metal dielectric region comprises dielectric material and the first inter-layer dielectric region comprises dielectric material, thus forming a dielectric-dielectric interface between the first inter-metal dielectric region and the inter-layer dielectric region."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Pad structure","description":"One or more techniques or systems for mitigating peeling associated with a pad, such as a pad of a semiconductor, are provided herein. In some embodiments, a pad structure for mitigating peeling compr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9699897","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9699897","citation_suggestion":"Patentable. \"Pad structure\" (US-9699897). https://patentable.app/patents/US-9699897","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9699897","json":"https://patentable.app/api/llm-context/US-9699897","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:39:58.740Z"}