{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9699921","patent":{"patent_number":"US-9699921","title":"Multi-layer wiring board","assignee":null,"inventors":[],"filing_date":"2014-08-01T00:00:00.000Z","publication_date":"2017-07-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A multi-layer wiring board that has stacked therein a first printed wiring bases on at least one surface of which a wiring pattern is formed and in which a conductive paste via is formed, that includes an electronic component terminal and a board terminal whose terminal pitch differs from that of the electronic component terminal, and that has an electronic component installed thereon via the electronic component terminal, wherein a second wiring base whose wiring pitch is smaller than that of the first wiring base is built in to a lower portion of an installing portion of the electronic component via the first wiring base, and the second wiring base is connected to the electronic component terminal via the conductive paste via of the first wiring base, has formed on both surfaces thereof a pattern that enlarges the terminal pitch from the electronic component terminal to the board terminal, and includes a via that connects the pattern of the both surfaces."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-layer wiring board","description":"A multi-layer wiring board that has stacked therein a first printed wiring bases on at least one surface of which a wiring pattern is formed and in which a conductive paste via is formed, that include","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9699921","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9699921","citation_suggestion":"Patentable. \"Multi-layer wiring board\" (US-9699921). https://patentable.app/patents/US-9699921","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9699921","json":"https://patentable.app/api/llm-context/US-9699921","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:41:47.806Z"}