{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9700963","patent":{"patent_number":"US-9700963","title":"Lead-free solder ball","assignee":null,"inventors":[],"filing_date":"2016-06-29T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Lead-free solder ball","description":"Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9700963","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9700963","citation_suggestion":"Patentable. \"Lead-free solder ball\" (US-9700963). https://patentable.app/patents/US-9700963","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9700963","json":"https://patentable.app/api/llm-context/US-9700963","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:45:33.221Z"}