{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704090","patent":{"patent_number":"US-9704090","title":"Package structure","assignee":null,"inventors":[],"filing_date":"2015-07-30T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["G06K","G06K","G06K","G06K","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A package structure includes a first member that surrounds a semiconductor device, a heat insulating material that surrounds an outer side of the first member, and a second member that surrounds an outer side of the head insulating material. The heat insulating material has a density and a thermal conductivity lower than those of the first and second members. The first member has a heat capacity larger than that of the second member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure","description":"A package structure includes a first member that surrounds a semiconductor device, a heat insulating material that surrounds an outer side of the first member, and a second member that surrounds an ou","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704090","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704090","citation_suggestion":"Patentable. \"Package structure\" (US-9704090). https://patentable.app/patents/US-9704090","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704090","json":"https://patentable.app/api/llm-context/US-9704090","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:51:20.076Z"}