{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704725","patent":{"patent_number":"US-9704725","title":"Semiconductor device with leadframe configured to facilitate reduced burr formation","assignee":null,"inventors":[],"filing_date":"2012-03-06T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor package or device including a uniquely configured leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a substantial reduction in burr formation resulting from a saw singulation process used to complete the fabrication of the semiconductor device. The semiconductor device includes a die pad defining multiple peripheral edge segments. In addition, the semiconductor device includes a plurality of leads which are provided in a prescribed arrangement. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, the lands, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die pad and the leads being exposed in a common exterior surface of the package body."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with leadframe configured to facilitate reduced burr formation","description":"A semiconductor package or device including a uniquely configured leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a substantial reduction in bu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704725","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704725","citation_suggestion":"Patentable. \"Semiconductor device with leadframe configured to facilitate reduced burr formation\" (US-9704725). https://patentable.app/patents/US-9704725","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704725","json":"https://patentable.app/api/llm-context/US-9704725","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:35:00.193Z"}