{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704749","patent":{"patent_number":"US-9704749","title":"Method of dividing wafer into dies","assignee":null,"inventors":[],"filing_date":"2015-12-16T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A method of dividing a wafer, having on one side a device area with a plurality of devices partitioned by a plurality of division lines and a peripheral marginal area with no devices formed around the device area, into dies is provided. The method comprises: attaching an adhesive tape for protecting devices on the wafer to the one side of the wafer, the adhesive tape adhering to at least some, optionally all, of the devices; connecting a carrier for supporting the adhesive tape to the side of the adhesive tape being opposite to the side in contact with the devices by connecting means; grinding that side of the wafer being opposite the one side for adjusting the wafer height; and cutting the wafer along the division lines. The method is characterized by locating the connecting means completely outward of the device area of the wafer in a top view thereon."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of dividing wafer into dies","description":"A method of dividing a wafer, having on one side a device area with a plurality of devices partitioned by a plurality of division lines and a peripheral marginal area with no devices formed around the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704749","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704749","citation_suggestion":"Patentable. \"Method of dividing wafer into dies\" (US-9704749). https://patentable.app/patents/US-9704749","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704749","json":"https://patentable.app/api/llm-context/US-9704749","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:36:04.017Z"}