{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704765","patent":{"patent_number":"US-9704765","title":"Method of controlling etch-pattern density and device made using such method","assignee":null,"inventors":[],"filing_date":"2015-07-31T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of controlling an etch-pattern density of a polysilicon layer includes depositing polysilicon on a wafer. The method includes determining polysilicon-etch regions that include DMOS source regions within circuit-device areas of the wafer. The method includes calculating an etch area of the polysilicon-etch regions and then comparing the calculated etch area of the polysilicon-etch regions to a predetermined minimum etch area. If the calculated etch area is less than a predetermined threshold, the method adds polysilicon-etch regions within non-circuit-device areas to the determined polysilicon-etch regions within the circuit-device areas until the comparing step results in the calculated etch area of the polysilicon-etch regions being greater than the predetermined minimum etch area. The method includes etching the polysilicon from the polysilicon-etch regions in both the circuit-device areas and the non-circuit-device areas. Adding polysilicon-etch regions in non-circuit device areas can advantageously facilitate automatic process control of an etch step."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of controlling etch-pattern density and device made using such method","description":"A method of controlling an etch-pattern density of a polysilicon layer includes depositing polysilicon on a wafer. The method includes determining polysilicon-etch regions that include DMOS source reg","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704765","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704765","citation_suggestion":"Patentable. \"Method of controlling etch-pattern density and device made using such method\" (US-9704765). https://patentable.app/patents/US-9704765","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704765","json":"https://patentable.app/api/llm-context/US-9704765","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:36:24.761Z"}