{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704767","patent":{"patent_number":"US-9704767","title":"Mold compound with reinforced fibers","assignee":null,"inventors":[],"filing_date":"2015-12-23T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Techniques and mechanisms for mitigating warpage of structures in a package. In an embodiment, a packaged integrated circuit device includes a mold compound disposed at least partially around an integrated circuit chip. The mold compound comprises fibers suspended in a media that is to aid in mechanical reinforcement of such fibers. The reinforced fibers contribute to mold compound properties that resist warping of the IC chip that might otherwise take place as a result of solder reflow or other processing. A modulus of elasticity of the mold compound is equal to or more than three GigePascals (3 GPa), where the modulus of elasticity corresponds to a temperature equal to two hundred and sixty degrees Celsius (260° C.). In another embodiment, a spiral flow value of the mold compound is equal to or more than sixty five centimeters (65 cm)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Mold compound with reinforced fibers","description":"Techniques and mechanisms for mitigating warpage of structures in a package. In an embodiment, a packaged integrated circuit device includes a mold compound disposed at least partially around an integ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704767","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704767","citation_suggestion":"Patentable. \"Mold compound with reinforced fibers\" (US-9704767). https://patentable.app/patents/US-9704767","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704767","json":"https://patentable.app/api/llm-context/US-9704767","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:35:07.299Z"}