{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704768","patent":{"patent_number":"US-9704768","title":"Power semiconductor module","assignee":null,"inventors":[],"filing_date":"2013-12-17T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":2,"abstract":"It is an object of the present invention to achieve reduced faults in manufacturing steps and increased reliability by relieving electric field strength of a surface of a power semiconductor chip. The present invention includes: a power semiconductor chip disposed on an insulating substrate; wiring connected to a surface conductor pattern in an element region of the power semiconductor chip; a low dielectric constant film disposed between the wiring and the peripheral region; and a sealing material formed so as to cover the insulating substrate, the power semiconductor chip, the wiring, and the low dielectric constant film. The low dielectric constant film has a dielectric constant lower than that of the sealing material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power semiconductor module","description":"It is an object of the present invention to achieve reduced faults in manufacturing steps and increased reliability by relieving electric field strength of a surface of a power semiconductor chip. The","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704768","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704768","citation_suggestion":"Patentable. \"Power semiconductor module\" (US-9704768). https://patentable.app/patents/US-9704768","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704768","json":"https://patentable.app/api/llm-context/US-9704768","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:35:44.170Z"}