{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704785","patent":{"patent_number":"US-9704785","title":"Semiconductor package with die paddle","assignee":null,"inventors":[],"filing_date":"2015-09-22T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":27,"abstract":"The invention provides a semiconductor package. The semiconductor package includes a lead frame including a die paddle. A supporting bar connects to the die paddle, extending in an outward direction from the die paddle. At least two power leads are separated from the die paddle and the supporting bar, having first terminals close to the die paddle and second terminals extending outward from the die paddle. A power bar connects to the at least two power leads, having a supporting portion. A molding material encapsulates the lead frame leaving the supporting portion exposed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with die paddle","description":"The invention provides a semiconductor package. The semiconductor package includes a lead frame including a die paddle. A supporting bar connects to the die paddle, extending in an outward direction f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704785","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704785","citation_suggestion":"Patentable. \"Semiconductor package with die paddle\" (US-9704785). https://patentable.app/patents/US-9704785","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704785","json":"https://patentable.app/api/llm-context/US-9704785","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:33:23.947Z"}