{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704787","patent":{"patent_number":"US-9704787","title":"Compact single-die power semiconductor package","assignee":null,"inventors":[],"filing_date":"2014-10-16T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"Disclosed is a power semiconductor package including a power transistor having a first power electrode and a gate electrode on its top surface and a second power electrode on its bottom surface. The second power electrode is configured for attachment to a partially etched leadframe segment, where the partially etched leadframe segment is attached to a substrate. A conductive clip is situated over the first power electrode and extends to the substrate in order to couple the first power electrode to the substrate without using a leadframe."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Compact single-die power semiconductor package","description":"Disclosed is a power semiconductor package including a power transistor having a first power electrode and a gate electrode on its top surface and a second power electrode on its bottom surface. The s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704787","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704787","citation_suggestion":"Patentable. \"Compact single-die power semiconductor package\" (US-9704787). https://patentable.app/patents/US-9704787","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704787","json":"https://patentable.app/api/llm-context/US-9704787","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:18:10.284Z"}