{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704809","patent":{"patent_number":"US-9704809","title":"Fan-out and heterogeneous packaging of electronic components","assignee":null,"inventors":[],"filing_date":"2013-06-28T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"Aspects of the disclosure pertain to a packaging structure configured for providing heterogeneous packaging of electronic components and a process for making same. The packaging structure includes a carrier substrate having a plurality of cavities formed therein. The packaging structure further includes a first die and a second die. The first die is at least substantially contained within a first cavity included in the plurality of cavities. The second die is at least substantially contained within a second cavity included in the plurality of cavities. The first die is fabricated via a first fabrication technology, and the second die is fabricated via a second fabrication technology, the second fabrication technology being different than the first fabrication technology. The packaging structure also includes electrical interconnect circuitry connected to (e.g., for electrically connecting) the first die, the second die and/or the carrier substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan-out and heterogeneous packaging of electronic components","description":"Aspects of the disclosure pertain to a packaging structure configured for providing heterogeneous packaging of electronic components and a process for making same. The packaging structure includes a c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704809","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704809","citation_suggestion":"Patentable. \"Fan-out and heterogeneous packaging of electronic components\" (US-9704809). https://patentable.app/patents/US-9704809","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704809","json":"https://patentable.app/api/llm-context/US-9704809","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:58:39.814Z"}