{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704812","patent":{"patent_number":"US-9704812","title":"Double-sided electronic package","assignee":null,"inventors":[],"filing_date":"2016-05-06T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Embodiments of a double-sided electronic package and methods for fabricating the same are disclosed. In an embodiment, an electronic package comprises: a substrate having a first surface and a second surface; a leadframe having package pad features attached to the first surface of the substrate; a first integrated circuit die attached to the leadframe and electrically coupled to at least one of the package pad features; and molding disposed on the first surface of the substrate between the package pad features, such that the package pad features extend vertically from the first surface of the substrate to a surface of the electronic package, the package pad features forming electrically conductive paths that are exposed on the surface of the electronic package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Double-sided electronic package","description":"Embodiments of a double-sided electronic package and methods for fabricating the same are disclosed. In an embodiment, an electronic package comprises: a substrate having a first surface and a second ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704812","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704812","citation_suggestion":"Patentable. \"Double-sided electronic package\" (US-9704812). https://patentable.app/patents/US-9704812","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704812","json":"https://patentable.app/api/llm-context/US-9704812","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:37:36.639Z"}