{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704819","patent":{"patent_number":"US-9704819","title":"Three dimensional fully molded power electronics module having a plurality of spacers for high power applications","assignee":null,"inventors":[],"filing_date":"2016-03-29T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Three dimensional fully molded power electronics module having a plurality of spacers for high power applications","description":"A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. T","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704819","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704819","citation_suggestion":"Patentable. \"Three dimensional fully molded power electronics module having a plurality of spacers for high power applications\" (US-9704819). https://patentable.app/patents/US-9704819","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704819","json":"https://patentable.app/api/llm-context/US-9704819","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:32:56.219Z"}