{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704820","patent":{"patent_number":"US-9704820","title":"Semiconductor manufacturing method and associated semiconductor manufacturing system","assignee":null,"inventors":[],"filing_date":"2016-02-26T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor manufacturing method is disclosed. The method includes: providing a first wafer and a second wafer, wherein the first wafer and the second wafer are bonded together; submerging the bonded first and second wafers in an ultrasonic transmitting medium; producing ultrasonic waves; and directing the ultrasonic waves to the bonded first and second wafers through the ultrasonic transmitting medium for a predetermined time period. An associated semiconductor manufacturing system for at least weakening a bonding strength of bonded wafers is also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor manufacturing method and associated semiconductor manufacturing system","description":"A semiconductor manufacturing method is disclosed. The method includes: providing a first wafer and a second wafer, wherein the first wafer and the second wafer are bonded together; submerging the bon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704820","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704820","citation_suggestion":"Patentable. \"Semiconductor manufacturing method and associated semiconductor manufacturing system\" (US-9704820). https://patentable.app/patents/US-9704820","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704820","json":"https://patentable.app/api/llm-context/US-9704820","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:33:58.146Z"}