{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9704829","patent":{"patent_number":"US-9704829","title":"Stacked structure of semiconductor chips having via holes and metal bumps","assignee":null,"inventors":[],"filing_date":"2015-10-14T00:00:00.000Z","publication_date":"2017-07-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":30,"abstract":"A stacked structure comprises a semiconductor chip which includes a substrate having at least one substrate via hole penetrating through the substrate; at least one backside metal layer formed on a backside of the substrate covering an inner surface of the substrate via hole and at least part of the backside of the substrate; at least one front-side metal layer formed on the front-side of the substrate and electrically connected to the at least one backside metal layer on a top of at least one of the at least one substrate via hole; at least one electronic device formed on the front-side of the substrate and electrically connected to the at least one front-side metal layer; and at least one metal bump formed on at least one of the backside metal layer and the front-side metal layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked structure of semiconductor chips having via holes and metal bumps","description":"A stacked structure comprises a semiconductor chip which includes a substrate having at least one substrate via hole penetrating through the substrate; at least one backside metal layer formed on a ba","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9704829","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9704829","citation_suggestion":"Patentable. \"Stacked structure of semiconductor chips having via holes and metal bumps\" (US-9704829). https://patentable.app/patents/US-9704829","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9704829","json":"https://patentable.app/api/llm-context/US-9704829","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:33:12.058Z"}